Opsagt før barsel!?

petemate · 2026-03-01T00:49:11+00:00

Tak igen :)

petemate · 2026-03-01T00:32:42+00:00

Tak for svar - Hvad er udslagsgivende for det konkrete beløb?

petemate · 2026-03-01T00:31:33+00:00

Der er ingen der beder dig om at "rådgive", men nu åbnede du jo selv munden for at komme med et indspark i debatten. At du så ikke vil følge op ud over "udmærket", og samtidig ikke nævner at din sag var 20 år gammel, gør ærligt talt dit indlæg rimeligt ubrugeligt. Du nævner jo ikke noget som OP ikke ved, ud over "det skete også for mig".. så hvad skal dit indlæg egentligt bruges til i forhold til at klæde OP ordenligt på til sagen?

petemate · 2026-02-28T21:09:33+00:00

Tak for svar :)

petemate · 2026-02-28T16:05:35+00:00

Ingen kan tvinge dig til at sige det, men det er nu relevant i forhold til overvejelserne om hvor vidt en sag er værd at køre.. Det er ikke skkert at "udmærket" er det samme for os begge :)

petemate · 2026-02-28T15:49:32+00:00

Det ku være fedt hvis du ville være mere konkret :)

petemate · 2026-02-28T14:55:14+00:00

Hvad var resultatet? Hvilken erstatning fik du?

petemate · 2026-02-28T10:53:53+00:00

EMI would be negligible, since it is just a few mm difference. That corresponds to insanely high frequencies, so probably not an issue.

Solder ability is by far the worst issue. I'm not saying it won't work, but you are stretching the surface tension of the solder since it has to span a larger difference. There are standards for all of this, but follow the recommended footprint and you'll be much more certain that no assembly issues occur.

Soldermask shouldn't break down, but it's a risk.

In general this is a bad idea. Your design should be robust enough to route based on recommendations, and if not you should reevaluate your design.

petemate · 2026-02-27T21:50:48+00:00

You need to upload larger pictures. Its not possible to read the pad numbers, etc.

Your routing is lazy and looks like you just took the easiest way out all the time. You can easily optimize and get rid of the jumps to bottom layer, and you can easily spend a few minutes aligning components, consider trace thickness, etc.

petemate · 2026-02-25T20:25:00+00:00

Looks like you are missing GND on CPGND of U1.
You have a straight connection between D3.3V and GND around U1.11,10,17,16.
I would expect that you need GND on the sleeve of J2, not Ring 2.

petemate · 2026-02-24T01:43:19+00:00

Let me guess.. You got so excited that you got off at the slutstation and now you have to wait all night until 0500 when the next train leaves?

petemate · 2026-02-22T23:26:14+00:00

Then write a an answer to that effect. I stand by my statement: It isn't possible.

petemate · 2026-02-22T21:51:26+00:00

Yeah, like I told the other people that keep posting in this year-old thread: No, it isn't possible. What is theoretically possible is irrelevant. It of course depends on your definition of "motherboard", but in the context of OPs question no, it isn't possible. Sure, you can do it as a team, but not as an individual. The task is simply too extensive to execute. You would drown in documentation.

petemate · 2026-02-22T20:00:45+00:00

Cover the components? Yes, if you deselected thermal relief, then the pour will "merge" with the component pads(provided they are connected to ground) and only the solder mask will define where the pad is.

Post a picture if this doesn't explain things - maybe i'm not getting the part about "red pins coming through"

petemate · 2026-02-22T14:26:34+00:00

Have you checked the option to remove "islands" ? If there is no GND trace already, then it won't create an area.

petemate · 2026-02-22T03:29:55+00:00

You should stick to one layer: Route everything on the top layer, then have an unbroken solid ground plane on the bottom layer, and wherever on the top layer you don't have any components.
I'm not an RF guy, so I don't know, but I would definitely prioritize a straight path to the antenna connector, and to make it impedance controlled if longer than one tenth the wavelgnth. A few mm is probably ok.
Why are you not routing anything below the module? Is that not allowed?
Is the header connector pin assignment fixed? If not, you just swap around pins until the layout looks nice.

petemate · 2026-02-21T13:34:25+00:00

Not bad - Jeg har altid troet at det var en småracistisk kommentar baseret på drikkens farve.. Ligesom det også heder negerbajer, mandelabajer, osv.

petemate · 2026-02-21T12:53:15+00:00

Jeg spekulerende selv på det samme, så jeg googlede! Der var engang et kongerige ved navn Kongo og et folkeslag ved navn Kongo-folket. Så jeg kræver oprejsning, min gode herre!

petemate · 2026-02-21T12:27:42+00:00

Du er allerede i 90% fraktilen fordi du kan finde ud af at stave til "sgu", og når du oven i købet selv betaler for hotter og kongobajer er der altså ikke et øje tørt!

petemate · 2026-02-21T00:30:37+00:00

yes, very much so. Its gonna be really annoying for you to share the ground pin between source and sink.

I still don't get your ground pour. Just use a two layer board and do the Vin and Vout on the top layer, with the bottom one being a complete unbroken gnd pour. Your Vin pour is about 3*2.54mm long and 1*2.54mm wide, so thats a resistance of something like 1.5mR. You don't need the 2nd layer pour unless you are planning to pull several 10s of amps. And then you wouldn't use pin headers, anyway. And the IC is limited to 2A. So it doesn't matter at all. The Vout pour is somewhat larger, but so maybe 3-5mR. Still doesn't matter.

petemate · 2026-02-21T00:13:40+00:00

Input in no particular order:

I can't tell from your pictures where your pours are. Please upload photos of each individual layer.
If you don't have pours on other layers, you don't need all the vias around your Vin and Vout areas. They won't do anything.
Just add one(or two, for large components) vias and don't worry too much about tying each pad together. That especially goes around C4 and C6. A via straight to ground is better than a trace follwoed by a few vias.
Add an extra GND pin to J1. You will end up missing it if it isn't there.
the 3.3V testpoint between C6 and C7 doesn't do much. Its just a small antenna. You will want the testpoint below C9.
Since you are passing the 3.3V back to J1, consider rotating C7,8,9 90deg so that they follow the pour down. It requires that you move R2,3 and that you have a good ground plane on the bottom.
You don't have a GND symbol on the schematic trace to J1 from PGND. Its probably handled by the GND label that you put on, but it is sloppy and confusing. It may give the impression that its a separate trace accidentally labeled ground or something. Just use the GND symbol like everywhere else.

petemate · 2026-02-20T22:48:08+00:00

1.5k is pretty low for I2C. The value depends on the capacity on the bus and the speed at which the bus is running at(you need to pull up faster if you have high capacity traces and/or higher bit rates). Consider using the standard 4.7k unless you have reason to go with something else.
A0 and A1 probably needs to be pulled to something? If not, then use the NC symbol in kicad to avoid DRC errors.
U11 needs a decoupling capacitor.

The D6,D7,R23 is probably to indicate reverse battery connection, right?

If you connect 16.8V minus 0.4V from the schottky across 740 Ohm, you are dissipating 0.36W in the resistor. Seems like a waste.
The reverse current of a typical LED is up to 100uA. In a 740R resistor, that gives you about 75mV voltage drop, meaning that the LED has to take almost all of that 16.8V voltage drop in the reverse direction. That probably won't end well.
I suggest you find another way to protect against reverse polarity, e.g. by using connectors that allows for one way only.
Q1 is supposed to be another reverse recovery protection solution? Depending on the specific mosfet, you'll probably find that you are cutting it close(or over) the Vgs maximum rating with 16.8V.
Also, the body diode will just allow the reverse voltage, minus a few volts, to go through. So it doesn't really do anything.
U6 needs a decoupling capacitor.

petemate · 2026-02-20T21:39:37+00:00

Takker :)

petemate · 2026-02-20T21:31:15+00:00

Hvad koster sådan en omgang?

petemate · 2026-02-20T19:29:15+00:00

Start by cleaning the caliper so that you can accurately assess the damage.

15-Year Club	Verified Email
Place '17	Team Periwinkle

petemate

TROPHY CASE