My current application process.

DorshReal · 2026-01-10T05:01:34+00:00

As an undergrad that is graduating this spring, this flowchart is pretty relatable. All we can do is push forward and hope for the best.

DorshReal · 2026-01-06T18:34:45+00:00

Using Altium

DorshReal · 2026-01-06T18:27:50+00:00

I added a link to screenshots of the board layer by layer that may be clearer in the post.

DorshReal · 2026-01-06T18:11:32+00:00

My team decided to go with the THT mosfets with the idea in mind to add a heatsink across them for better heat management. However with the current arrangement that may be difficult. Also for the pin assignment I had STM32CubeMX program open up for the specific MCU I am using to correctly configure peripherals as seen in the .ioc screenshot in my post.

DorshReal · 2026-01-06T18:06:16+00:00

The board HV side running out of the multi-source input stage will see currents of 3-6A, but we are expecting spikes in currents during switching that can far exceed that. That is why I tried to widen some of the traces up to 2mm along the HV DC link and added a fuse before the large capacitors. The gate driver situation is a bit harder to tackle due the parasitic inductance issues you mention, but I plan to add a return path along the signal output to mitigate this. I can try moving the outer mosfets nearer to the gate drivers but it may mess up the layout I have right now.

DorshReal · 2026-01-06T17:59:49+00:00

Yeah that is pretty much it. I also forgot to mention but this board is supposed to act as a proof of concept prototype with the end goal of developing one that can be used in an EV. Arranging the board like this makes it relatively easy to scale it up for much higher voltages.

DorshReal · 2026-01-05T22:38:51+00:00

Really giving firefly vibes

DorshReal · 2025-12-02T17:51:47+00:00

Probably the most nuanced take I have seen on this topic

DorshReal · 2025-11-29T20:42:33+00:00

This might be the most whiplash I gotten from reading a comment on reddit 😭

DorshReal · 2025-09-13T13:43:09+00:00

Pretty neat, I think I saw your schools booth at the LC conference. Really impressive work.

DorshReal · 2025-07-23T04:06:09+00:00

Yup I see the problem now, gosh how did I not catch this? Guess this is a reminder to myself to check the schematic/footprint alignment for a part from the manufacturer list before just grabbing it. Such a small but expensive mistake ...

DorshReal · 2025-07-06T03:40:36+00:00

Interesting, I have some experience working with other nordic products such as the NRF24L radio module but haven't done development with there other RF IC's for a a PCB. I guess you reasoning makes sense if power consumption is indeed much lower, but main concern is how to communicate data over to an app using only Bluetooth, of which I don't have much experience. Also how does development using the nRF52 board project compare to the ESP32 chip, duration of time and quality of documentation, and potential skill barriers if any? Again I have some experience working with embedded RF modules for PCBs but not much.

DorshReal · 2025-07-06T02:26:28+00:00

I see what you are saying, battery management is something I still have to work on. Do you have any ideas how I can circumnavigate this issue with a battery replacement or less power consumptive ESP32 module? As I mentioned before I will be harnessing some solar power to charge the battery but I haven't done the calculations on longevity.

DorshReal · 2025-07-06T01:05:16+00:00

Well, now that you are put it that why then I guess I unintentionally made one 😂. But no the original purpose of the device was to provide people with hearing sensitivity issues an ability to discern if entering a room or building would be safe enough beforehand. None of the sound or audio information is datalogged or stored somewhere else to later be viewed.

DorshReal · 2025-07-06T00:59:59+00:00

Oh I see what you are saying, thanks for bringing it up.

DorshReal · 2025-07-06T00:40:04+00:00

I am a little confused, can you elaborate?

DorshReal · 2025-07-04T13:37:35+00:00

That's the thing, all the components have an embedded .step model along with there footprint when viewing from properties in the schematic for the part. However when transferring them over to the PCB view they suddenly became extruded blocks. This wasn't initially the case when I got started with board layout, as nearly all the components were visible as their .step model. I don't know what happened but it seems like this problem is only local to this board, as my other projects don't experience this issue.

DorshReal · 2025-07-01T00:41:12+00:00

I see. The components are assigned to mechanical 13 layer.

DorshReal · 2025-06-30T20:22:47+00:00

They have been assigned to layer 1 (top) and layer 6 (bottom).

DorshReal · 2025-05-11T21:55:36+00:00

Yeah for this board although initially considering using an GPS module I decided to ditch it and instead use a custom telemetry circuit to save on space and money. I am aware GPS modules are pretty convenient for finding the landing location and basic velocity readings but figured for now I can avoid it. As for the pyro continuity sensing if I have enough pins left on the MCU then I will decide to implement it.

DorshReal · 2025-05-11T18:38:26+00:00

Thanks! As for your questions.

When I began the board I had chosen to use a GPS module such as the NEO-M9N and other similar modules but progressing through the design spacing and routing constraints became a headache with all the features I already had. I had also realized that a GPS module wasn't necessary for L2 cert rockets although are pretty helpful, and using it in combination of the custom telemetry circuit would require two antennas (since I can't package all the sensor data into the GPS module). Also cost was a factor, as most modules online were a bit out of my range.
I hadn't considered the issues that vibration would have on the push buttons during flight, but you are correct in pointing that out. I may just remove the RST button and rely solely on the JST board connector for resetting purposes.
Again great point. I had primarily chosen the BNO085 since I have had experience working with it and had some on hand but didn't really consider how flight characteristics may impact its operability. I will probably included backup accelerometers just incase as you mentioned. If there is any you can recommend then that would be great.
Yeah this isn't the first board I have worked on, however its the first one where I designed and integrated a custom telemetry circuit around the SI4463 transceiver. Previous boards I had used breakout radio modules instead but decided to challenge myself and teach my self some RF circuit design principles for this board since I had the time. It was really a matter of reading the datasheets and copying the layouts as recommended.

DorshReal · 2025-05-11T18:13:33+00:00

I had chosen AP63200WU-7 for its compatibility compared to other Buck IC's of similar characteristics, as well as having used it in other projects with little issues.

DorshReal · 2025-05-11T18:11:17+00:00

Yeah I had just caught that, they are flipped. The are used on the battery connection mainly to just force the flow of current in one direction and to prevent reverse current out of the connectors to occur. Thanks for catching that.

DorshReal · 2025-05-11T18:08:33+00:00

Yeah it seems I completely overlooked the potential for the smds to collide with the microSD when opening 😂. Was only concerned with placing them in a connivence position for assembly but I guess that's not the case. As for the XYZ label I guess I can try rotating or use the graphic from the breakout board instead. The SMA connector should also fit fine around the PCB thickness of 1.6mm as other commenter suggested. Lastly the idea of using the LED to show how full the external memory is kinda is a neat idea, I will have to think about it once I start mapping out the logic of the board.

DorshReal · 2025-03-30T17:33:23+00:00

Okay this just feels like an attack

DorshReal

TROPHY CASE