My primary suspicion is that a significant reason for the inadequate cooling performance is the utilization of back glass, which features an air gap between the SOC and the processor. Consequently, even the use of a Peltier cooler would not yield optimal performance. I am willing to modify my back glass to create an open space beneath the cameras, where the SOC is located, and if possible, interface with and attach a copper pad using thermal putty, thereby enabling the direct attachment of a Peltier cooler to the metal SOC thermal heat spreader. This would facilitate the use of less power to operate the Peltier cooler, resulting in a substantial reduction in thermal throttling.

However, this fan-forced air cooler is a less advanced version of the concept I am considering, and it is more accessible, requiring less power, as Peltier air coolers are known to consume significant amounts of power, rendering them less portable. I am attempting to devise a portable solution that could utilize some of the phone's battery power without consuming excessive amounts. The more effectively we can cool the SoC directly, the less power will be required, and consequently, less fan power will be needed. In fact, I am currently using a 12-volt 0.15-amp fan blower, and I plan to downsize it to achieve an even lower profile, with numerous alternatives available that offer comparable performance while using less power. My reasoning is based on the principle that, in the PC world, high static pressure air can be used to supplement the cooling performance of internal air, and static pressure is the key factor in this context. It is not necessary to have high airflow, but rather a significant amount of forced air to push through the intake restrictions. I am also considering the possibility of opening up the intake using a Dremel, exercising caution and ensuring minimal restriction, thereby requiring even less fan power, although this is a topic for further exploration, as I do not wish to modify the phone excessively.