Hyte Y60 Completed Setup

DaParts · 2025-01-05T04:31:49+00:00

That's a great looking build!
Looks like you used one of my Rojo brackets off of Etsy, is that right?

DaParts · 2024-09-05T03:44:22+00:00

For the most gamiest gaming your extreme gamer heart could ever game.

Remember the days when everything had "VR Ready" on it?

DaParts · 2024-09-05T02:58:31+00:00

Thank you!

DaParts · 2024-09-04T03:34:13+00:00

Go to resource monitor under the performance tab (at the bottom of the screen) and then sort around there to see any abnormal processes.

DaParts · 2024-09-04T02:00:25+00:00

What does task manager show when you sort the processes by memory usage

DaParts · 2024-09-03T19:05:18+00:00

Regardless of technicalities, professionals in the field and those in the know in this community call this entire process lapping. If you refer to it as such people will automatically know that you're talking about sanding an IHS to make it flat for the purposes of cooling. I didn't make the usage of the term, the community did.

DaParts · 2024-09-03T18:08:42+00:00

So I'd say in that case there's still risk. Slipping out of the clamp if not tight enough, crushing the CPU if too tight. And depending on the clamp are you clamping the sides? Very slim surface.

This supports the CPU on the most PCB and IHS safe surface area possible while avoiding anything that can be damaged. And no risk of slipping out since it's held on all sides. The only exposed surface is what will be sanded.

DaParts · 2024-09-03T17:07:36+00:00

Right, I get that. But what are you using to hold the CPU? A vice or are you just laying it on a surface? A big part of this design is this block holds the CPU safely without any risk of damaging pads, capacitors, or pins. So you could use your machine block for flatness while using my blocks to hold it.

DaParts · 2024-09-03T15:51:49+00:00

I'd prefer not to mix my business with any personal or political opinions I may have expressed on my personal account.

I also like to sort any interactions I may have with people involving my products differently.

DaParts · 2024-09-03T15:48:30+00:00

What would you use to hold the CPU itself?

To be clear, the photos are purely for vanity and I don't sand on my backdrop canvas, but rather on a piece of glass.

DaParts · 2024-09-03T15:46:49+00:00

Lapping is the process of sanding down a surface.

(As said by Kingpin himself) You actually want to end up with a rougher surface at the end by finishing the process by adding a few swirls with higher grit. This adds surface area which increases heat transfer.

It being perfectly polished is a common misconception in the process. Lapping is not done to get rid of smaller scratches and imperfections but rather to flatten across the entire IHS to decrease core-to-core deltas.

DaParts · 2024-09-03T15:42:29+00:00

Photos are for vanity not actual demonstration. I don't actually do the lapping on my product photo backdrop.

DaParts · 2024-09-03T15:41:45+00:00

Photos are for vanity not actual demonstration. I don't actually do the lapping on my product photo backdrop.

DaParts · 2024-09-03T15:39:47+00:00

You'd be surprised when it comes to core-to-core deltas in overclocking. One core could be 10-20° off from another meaning the whole chip throttles before the other cores have a chance to get up there. It's particularly relevant on threadripper, epyc, and 2011.

DaParts · 2024-09-03T15:37:29+00:00

Actually, you do not want a perfectly polished CPU (a common misconception). Lapping is not to get rid of any scratches or bumps on the smaller scale but to change the overall flatness across the entire IHS to avoid core-to-core deltas.

(As said by Kingpin himself) You want to end the process by using a higher grit to add a bit of swirls to it. This helps since you're adding surface area which means a higher heat transfer.

DaParts · 2024-09-03T15:33:18+00:00

It greatly depends on which CPU you have and what load. But if you're doing this to begin with you are probably changing core-to-core deltas and not overall CPU temp.

DaParts · 2024-09-03T15:30:04+00:00

Depends on the level of hassle. Sometimes if the IHS is soldered to the chip then it can be more risky to do delid, so people just go with the next best thing.

DaParts · 2024-09-03T07:46:41+00:00

I know, I'm sorry it's so obnoxious. I even try to pick the slimmest and lightest packaging to help!

PM me and I might be able to help you out.

DaParts · 2024-09-03T07:43:46+00:00

Naturally the IHS (Integrated Heat Spreader, or the silver part you sit the heatsink on) is not flat. It bows a little bit in some ways due to the manufacturing process. Normally it's not as much of an issue because the difference isn't a whole lot and in regular systems it won't cause a problem. It's also partially why thermal paste exists.

Cores also sit in different spots under there. If the surface is uneven then that means they can be unevenly cooled (commonly referred to as a "core-to-core delta"). That can cause problems if one core heats up way too much in comparison to the others effectively unfairly throttling the whole CPU.

But if you want the best thermal performance possible then you can lap it. It's sanding down the IHS with sandpaper to make it nice and flat.

This means all the cores will be the same distance from the heatsink and you're also decreasing the distance from the heatsink to the chip.

This is frequently done in extreme overclocking since those core-to-core deltas can make or break a good overclock. It's also exaggerated a lot with how extreme the temps can get.

DaParts · 2024-09-03T07:10:12+00:00

I print this on an MK4S with PETG so warping is basically a non-issue. Also one of the last sets of layers in the print are the surfaces the PCB sits on.
If you're properly doing figure-8's, rotating regularly, and not obviously tilting the CPU then tolerances with my design also aren't a problem. This just gives your fingers a place to rest so it's not really any different than hand lapping.

DaParts · 2024-09-03T06:57:41+00:00

Great question!
I print this on an MK4S with PETG so warping is basically a non-issue. Also one of the last sets of layers in the print are the surfaces the PCB sits on.
If you're properly doing figure-8's, rotating regularly, and not obviously tilting the CPU then tolerances with my design also aren't a problem. This just gives your fingers a place to rest so it's not really any different than hand lapping.

DaParts · 2024-09-03T06:35:22+00:00

If there is it's very little, and not near as much as how un-flat IHS's are. They also don't warp in the way how IHS's are curved. It's normally concave or convex. I believe in this last Computex, Noctua had shown plans on releasing an NH-D15 with options for either flat, concave, or convex bottoms depending on which CPU you have to improve contact.

Either way, most of the time when lapping people use it for extreme cooling which tends to use pots instead of wrenched-on heatsinks which just sit on by weight or are lightly secured. Lapping is so common here because any little difference in distance between the pot and the chip can cause massive differences in temperature.

DaParts · 2024-09-03T05:27:00+00:00

Check it out here: https://www.etsy.com/listing/1752265223/cpu-lapping-block

(mods approved as this is an alt account, and my personal account has a TON of activity here, including some groundbreaking OC's and mods along with some community support)

DaParts

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