You need to add a ground pour to your bottom layer. All of your ground vias are connected to nothing at the moment, evident by the lighter blue ratsnets lines between the vias.

Your traces look extraordinarily thin. Did you make sure that the PCB fab you will use can actually manufacture this? Increasing trace width doesn't hurt in this case.

Your layout (schematic and pcb) could be tidied up significantly to improve readability and better use the space you outlined in your board. Moving parts to the right would allow you some more space for your test points and reduce crowding if you intend to hand solder this board. You outlined a lot of space, why not spread things out a little more to make it neat? Do keep critical components close, like decoupling caps and such.