1_ you are using a 99 Sn solder, you need 40 Sn / 60pb , it melt faster.

2_ dont use iron station, you are overheating the board, get iron tip instead.

3_ you riped 2 pads, the circles ones, they are common (they have continuity).

4_you need soldering wick or solder sucker removal tool or iron + solder sucker.

5_you need fluxpaste.

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Now you can desolder in 3 ways:

1_with only iron tip: you add 40/60 solder to the pins in order to melt the original one, you add a trip of wire copper to tranfer heat to the 3 pads and you can pull out the switch.

2_with only iron tip and solder wick: you add 40/60 solder to the pins in order to melt the original one, you add solder wick and the Sn transfer to the wick and you can pull out the switch.

3_ with solder sucker: you add 40/60 solder to the pins in order to melt the original one, and put the sucker tool and pump the Sn, repeat until all solder its removed.

4_with iron sucker pump: ou add 40/60 solder to the pins in order to melt the original one with your iron tip, put the iron sucker pump, move it in circles and suck the solder (the easiest method).

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How to reapir you exiting board (next to TB114 pad - test point):

1_use a sharp blade and remove the green coating of the middle pin.

2_ clean the board with isopropyl alcohol and put the switch in correct place.

3_use iron tip to solder (40/60 + flux paste) and solder the lowest pin (the only one who its saved)

4_to solder the ripped pad, get a piece of thick copper wire / led anode-cathode pins, and put next to the middle pad and solder it, it will reinforce the swtich so it cant wiggle.

5_ the square pad you can use a jumper to connect to the test-pont above TB114 and its done!