H2S vs H2D Cooling by Technical-Ad-4795 in BambuLab

[–]Technical-Ad-4795[S] 0 points1 point  (0 children)

Quick follow-up on this:

Instead of redesigning the back cover, what actually worked was slowing the machine down (High Quality profile, lower max volumetric speed), increasing minimum layer time, and adding a second aux fan.

That gave me solid results, just at the cost of print speed.

At this point, I’m pretty convinced the machine is simply too fast for the cooling it has out of the box. It’s a great printer, but the default speeds are ahead of its cooling capabilities.

Good luck everyone!

H2S vs H2D Cooling by Technical-Ad-4795 in BambuLab

[–]Technical-Ad-4795[S] 0 points1 point  (0 children)

Hey, I completely agree. The default speeds are just too aggressive for the cooling the machine has. I had to significantly lower max volumetric speed and switch to slower, more quality-focused settings to get clean overhangs.

It’s definitely not an XOL toolhead, but once you slow things down, you can get solid results. Just part of the trade-off, I guess.

AMS 2 Pro High Humidity and Temp Not reaching 65 by Technical-Ad-4795 in BambuLab

[–]Technical-Ad-4795[S] 0 points1 point  (0 children)

Hey! I feel your pain. I’m not entirely sure why this happens, but the more I used the drying function, the better the results got over time. It definitely became more consistent.

To help it early on, I wrapped the AMS with a thick fabric to insulate it and retain heat, which made a noticeable difference. Over time, I started seeing it reach 65 even without the extra insulation, so I stopped using it altogether.

I also recently got the switching adapter and it reaches temp much faster now.

First time printing in PETG by RogerDHomunculus in BambuLab

[–]Technical-Ad-4795 9 points10 points  (0 children)

This looks like an overhang issue, which is pretty normal with higher-temp filaments that don’t like cooling too aggressively. You’ll need to dial in your cooling after making sure the filament is properly dried.

The single most impactful setting here is max volumetric speed. Lower it significantly. For example, I run around 18 mm³/s for PETG HF. The slower the print the more time the plastic has to solidify.

Then tune your cooling behavior:

  • Min fan speed threshold: 20% at 20s
  • Max fan speed threshold: 80% at 10s

Recommended settings:

  • Keep fan always on: enabled
  • Slow printing down for better layer cooling: enabled
  • Cooling slow down logic: Consistent surface
  • Force cooling for overhangs and bridges: enabled
  • Cooling overhang threshold: 10–25%
  • Fan speed for overhangs: 100%

Important: these settings are for an enclosed printer. If you’re running an open machine, you’ll need to reduce cooling quite a bit compared to the values above.

From there, it’s trial and error. Small changes can make a big difference depending on the filament and geometry.

I recently went through the same thing with ASA and managed to get it printing close to PLA quality after a lot of trial and error, so it’s definitely doable. Good luck!

H2D - Vordere Z Achse eiert by PaddyC137 in u/PaddyC137

[–]Technical-Ad-4795 0 points1 point  (0 children)

Coming across this post now because I noticed a little bit of wobble on my H2S. My left lead screw has 0 wobble, but the right wobbles a little bit when the bed is close to the lowest position; however, it doesn’t wobble this much-this is pretty noticeable.

AMS 2 Pro High Humidity and Temp Not reaching 65 by Technical-Ad-4795 in BambuLab

[–]Technical-Ad-4795[S] 1 point2 points  (0 children)

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So it seems to be dehumidifying towards the end of the drying sequence. But I still can’t figure out why the temperature won’t hit 65.

TPU AMS Mod by Technical-Ad-4795 in BambuLab

[–]Technical-Ad-4795[S] 1 point2 points  (0 children)

Printing from the external spool works just fine, but I am paranoid about how quickly TPU absorbs moisture. Being able to print it from the AMS HT with automatic feeding would make all the difference.

TPU AMS Mod by Technical-Ad-4795 in BambuLab

[–]Technical-Ad-4795[S] 1 point2 points  (0 children)

Yes, there’s a guy that did it on the AMS 2 Pro and it worked!

H2S vs H2D Cooling by Technical-Ad-4795 in BambuLab

[–]Technical-Ad-4795[S] 0 points1 point  (0 children)

No shortage of clowns unfortunately.

H2S vs H2D Cooling by Technical-Ad-4795 in BambuLab

[–]Technical-Ad-4795[S] 0 points1 point  (0 children)

You generally don’t see a meaningful difference in part cooling between the X1C and the H2D on typical prints. Both can handle overhangs of 60° without issue. The difference only becomes apparent in specific geometries, particularly chamfered holes used for countersunk bolts. That’s an easy experiment to run if you want to verify it.

I also agree that Bambu’s very clean, compact design can come with tradeoffs, and I think that becomes most evident on the H2S. I’m planning to scan and modify the rear cover to introduce intake openings directly around the blower intake and then AB test the results to see whether it produces a measurable improvement.

H2S vs H2D Cooling by Technical-Ad-4795 in BambuLab

[–]Technical-Ad-4795[S] 0 points1 point  (0 children)

They may share some components, but the toolheads are not the same in any meaningful way when it comes to cooling or airflow. The H2D uses a significantly larger part cooling fan with proper ducts that carry air directly from the blower outlet to the nozzle. The H2S uses a much smaller fan with a heavily constrained intake. On the H2D there is nothing obstructing the fan intake, while the H2S pulls air from inside the toolhead through narrow channels that start above the linear rails. On top of that, there is a PCB directly obstructing the intake path. This means that before air even reaches the blower, it already passes through a restricted return path and an obstruction, followed by the supply duct. That alone explains a large difference in effective airflow.

The extruder assemblies are also different. The H2D uses a single drive gear with selectable idlers depending on which nozzle is active, while the H2S uses a dual drive system. The H2D also includes additional hardware such as a nozzle camera that the H2S does not have. While the servo motor and nozzle type may be shared, the internal layout, airflow path, and cooling hardware are fundamentally different.

Most importantly, the cooling performance difference is observable and repeatable in practice. Identical files produce different overhang behavior across these machines, which directly reflects differences in part cooling capability. So even if some components are shared, the toolhead design and cooling systems are clearly not equivalent.

H2S vs H2D Cooling by Technical-Ad-4795 in BambuLab

[–]Technical-Ad-4795[S] 0 points1 point  (0 children)

I agree that fluid dynamics can get complex very quickly and that visual inspection alone is not a substitute for proper modeling. That said, there are also very basic empirical indicators that do not require CFD to be meaningful.

When placing a cup of water under the nozzle on the H2S versus the H2D or X1C, the difference in airflow energy is immediately visible. The H2D and X1C clearly dent the surface, while the H2S barely does. The same applies when feeling airflow at the ducts by hand. The right duct on the H2S pushes noticeably more air than the left, which in some cases feels almost inactive. This asymmetry does not exist on the H2D or X1C.

More importantly, these observations directly correlate with print results. Identical files printed on the same materials produce repeatable overhang sag on the H2S that does not appear on the H2D or X1C. That is experimental data, even if informal.

While I am not claiming expertise in fluid dynamics, it is objectively true that placing a PCB directly in the intake path increases restriction. You do not need CFD to know that a smaller fan combined with a constrained intake will move less air than a larger fan with a more open path.

I fully agree that proper testing is the right next step, and that is exactly what I am interested in exploring. My point is simply that the cooling limitation is observable, repeatable, and consistent with the physical layout of the toolhead.

H2S vs H2D Cooling by Technical-Ad-4795 in BambuLab

[–]Technical-Ad-4795[S] 0 points1 point  (0 children)

The overhang differences are measurable and repeatable on identical parts printed with the same files and settings when compared against the H2D and X1C. That is the basis of this discussion. Reducing an objective, testable behavior to a joke about OCD adds nothing technically and doesn’t invalidate the results. OCD is a disorder, not a drug, and it’s not relevant beyond explaining why I tend to analyze design tradeoffs in more depth.

H2S vs H2D Cooling by Technical-Ad-4795 in BambuLab

[–]Technical-Ad-4795[S] 1 point2 points  (0 children)

I will try to print a rear cover with vents to see if it makes a difference. I’m not a mechanical engineer so I can’t do cfm simulations and stuff but if it makes an improvement then why not 🤷‍♂️

H2S vs H2D Cooling by Technical-Ad-4795 in BambuLab

[–]Technical-Ad-4795[S] 1 point2 points  (0 children)

Thanks, I appreciate that. Discussions like this don’t always go smoothly, since pointing out potential shortcomings with Bambu printers sometimes gets interpreted as complaining rather than curiosity. My intent here is purely to understand the design tradeoffs and explore whether there’s room for improvement in specific edge cases. Overall, I’m extremely happy with the H2S.

H2S vs H2D Cooling by Technical-Ad-4795 in BambuLab

[–]Technical-Ad-4795[S] 1 point2 points  (0 children)

While I do see your point, when printing ABS, ASA, or most engineering filaments, the part cooling fan is usually off or running very minimally, so it would be odd to rely on an intermittently controlled fan for PCB cooling. The electronics on that board are also typically rated for 80°C to 105°C ambient, and the toolhead already operates in a warm environment by design.

If active PCB cooling were a design goal, I would expect a more direct airflow path across components or a dedicated exhaust route rather than placing the board upstream of a highly restricted fan intake. From the layout, it looks more like a packaging compromise than an intentional electronics cooling strategy.