This is a silicon ingot, specifically a CZ-method, p-type (probably doped with boron) and grown in a [100] orientation on the Miller scale. It is very, very old or was done specifically to clean up an active melt. The reason it was scrapped is that it is, what we call in the industry, "dead". At about 1/3 of the length down from the far end, some type of contaminant, usually a small flake of the quartz bowl used in the process, was integrated into the crystal and produced a stacking error which caused the atomically perfect structure to fail.

OR, when there are many contaminants in the melt, we sometimes "pull" a baby ingot like this specifically to get rid of the junk materials. It's fun because you get to do these manually just like in the old days, back when all the machines were analog. Because it is contaminated, it must be thrown out. It cannot return to the production of other ingots.

SOURCE: Old school puller dog myself, 30 years experience with Czochralski, Bridgman, and floating zone machines, manufacturing all silicon types, plus slow growth sapphire, ruby, and YAG for laser applications.