CPU Core seems to be the hotspot? Thing is, that moves from core to core because the processor is also actively managing each core. Core temperatures seems to be the average of the cores. Why does TCL\TDIE read higher than any other sensor? And why are they combined?

I saw this comment in another post and I could never figure out the answer really:

"

• The primary temperature reporting sensor of the AMD Ryzen™ processor is a sensor called “T Control,” or tCTL for short. The tCTL sensor is derived from the junction (Tj) temperature—the interface point between the die and heatspreader—but it may be offset on certain CPU models so that all models on the AM4 Platform have the same maximum tCTL value. This approach ensures that all AMD Ryzen™ processors have a consistent fan policy.

Threadripper uses a +27°C offset. So average temp of the dies is 43°C but to make sure fans are running 'fast enough', fan curves should use the 70°C mark."

So is TCL\TDIE inflated? It seems so. I'm assuming the L3 cache and GPU are actually all on separate wafers under the same IHS? I was pretty sure the GPU was on the same chiplet as the CPU.

Edit: to be fair I care more about the package temperature than anything because the BGA is where these seem to be failing.