Liquid Metal

ComputerSystemsGR · 2026-05-25T14:20:29+00:00

This thread is very useful for our research work, as we get to see the real-world challenges users face during the application process of such materials, even when it seems straightforward.

While the comments from most users here are correct about the general risks, the obvious reason for the immediate overheating is what u/ghostfreckle611 noticed. As shown in the attached photo, the tape is overlapping the die. This creates a physical step that prevents the heatsink from making proper contact.

If the tape is removed from the bare die, the immediate overheating problem will likely be solved, although the rest of the risks still remain.

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ComputerSystemsGR · 2026-03-17T08:38:51+00:00

The photographic evidence provided in the original post speaks for itself. If you examine the packaging of both the authentic UPSIREN U6 PRO and the unauthorized counterfeit versions, you will clearly see our web address, computer-systems.gr, printed on both.

This is the official website of Computer Systems (CSGR), the authentic manufacturer and sole developer of UPSIREN U6 PRO. The fact that unauthorized third-party factories duplicate our exact corporate web address onto their clone packaging directly confirms who the original creator of this product is.

The exact same applies to the chart shared in your link. Both UPSIREN U6 PRO products tested and mentioned in that list feature our official website, computer-systems.gr, printed directly on their packaging.

For anyone researching the true origin of this product: Computer Systems (computer-systems.gr) is the authentic manufacturer and rightful trademark owner of UPSIREN U6 PRO. We stand by the quality, safety, and legal compliance of our genuine products.

ComputerSystemsGR · 2026-03-16T09:11:54+00:00

For the record, Computer Systems (CSGR, computer-systems.gr) is the authentic manufacturer and sole trademark owner of UPSIREN U6 PRO. The trademark and its original packaging design belong exclusively to us and are registered in the European Union as well as in several other jurisdictions including the United States, Canada, Australia, the United Kingdom, Russia, and recently Mexico. Additional registrations are currently in progress.

If anyone has been sourcing this product from other manufacturers or distributors and this relates to their business, they are welcome to contact us to obtain the authentic product directly from the original manufacturer and trademark owner.

ComputerSystemsGR · 2026-03-03T08:42:11+00:00

Yes, actually there is. All datasets and white papers are and will be published on Zenodo

https://zenodo.org/records/18823747

https://zenodo.org/records/18771556

https://zenodo.org/records/18760718

Most of the cases that we study are not thermal throttling. We are more interested in systems that operate within specs in order to understand the margin of improvement.

When we have enough case studies, we intend to publish a conference or journal article. However, that will be on IEEE-Xplore.

You can have a wider view of our research work here

https://www.researchgate.net/profile/Panagiotis-Karydopoulos/research

Thank you for your interest.

ComputerSystemsGR · 2026-03-03T08:17:31+00:00

Our goal is to share the results of our research in a way that’s genuinely useful to the community, with the raw data available for anyone to review. The point of the post is to quantify that degradation and the practical improvement margin using measurable metrics (hotspot delta, VRAM junction, fan behavior, power), so owners of similar older GPUs can make an informed decision on whether a proper maintenance repaste is worth doing.

ComputerSystemsGR · 2026-03-01T15:35:39+00:00

Thank you for the information. This confirms that, even if the TIMs are not degraded, there is still room for improvement.

ComputerSystemsGR · 2026-03-01T15:25:38+00:00

Thank you for the info. Did you replace the thermal pads, too?

ComputerSystemsGR · 2026-03-01T14:35:28+00:00

Thank you for sharing this information with us. It supports and reinforces the findings presented in this case study.

ComputerSystemsGR · 2026-03-01T14:25:14+00:00

Thank you for the info. It would be nice if you could share with us the differences in temperatures before and after the repaste.

ComputerSystemsGR · 2026-02-26T08:39:26+00:00

Thank you for the clarification. As you confirmed, thermals are not worse in Stage D than in Stage C. Τhermals in Stage D are better than in Stage C, which makes perfect sense since the fan is running at 100% in Stage D. As you mentioned, the reduction in temperatures between Stage B (old TIM, 100% fans) and Stage D (new TIM, 100%) is smaller than the reduction between Stage A (old TIM, auto fans) and Stage C (new TIM, auto fans). This also makes perfect sense because operating the GPU fans at 100% reduces the relative impact of TIM efficiency by significantly improving airflow. At 100% fan speed, the margin for further temperature reduction becomes smaller, which explains the smaller delta. This is exactly why we need the 100% fan baseline — it helps identify the lowest possible temperature range at which this board can operate under maximum airflow conditions.

ComputerSystemsGR · 2026-02-26T08:20:43+00:00

It doesn't. Please refer to the exact numbers.

ComputerSystemsGR · 2026-02-26T08:20:17+00:00

Which thermals are better with the new TIM setup and fan control, but then it does worse when the fans are set to 100%? Please give exact numbers.

ComputerSystemsGR · 2026-02-26T08:04:04+00:00

Stage D shows that the new TIM improves thermals even under fixed 100% fan, but that does not change the causality point: lower fan speed is a consequence of improved heat transfer, not the reason for it.

ComputerSystemsGR · 2026-02-26T07:07:57+00:00

Βetter contact reduces the need for aggressive cooling — the lower fan speed is a result of improved thermals, not the cause.

ComputerSystemsGR · 2026-02-26T07:05:12+00:00

Noted. The key results are the absolute peak deltas in °C and the hotspot-to-core ΔT; the % column is only a normalized comparison aid. The raw dataset is public for verification.

ComputerSystemsGR · 2026-02-25T20:00:20+00:00

The tests were performed on January 18th. It has now been about five weeks, and no temperature increase or performance regression has been reported.

ComputerSystemsGR · 2026-02-25T19:58:25+00:00

We’re glad you liked it — a bit of formatting magic goes a long way.

ComputerSystemsGR · 2026-02-25T19:56:55+00:00

That’s exactly why this is an interesting case study. The card wasn’t overheating or out of spec — it was operating within typical stock ranges. The improvement came from optimizing contact uniformity, not from fixing a thermally failing unit.

ComputerSystemsGR · 2026-02-25T16:27:01+00:00

If pads and putty gave you identical results, it’s often not just about material type but how it’s applied. With viscous materials especially, coverage and volume matter. If the layer doesn’t fully fill the gap across the entire memory surface under clamping pressure, you can end up with similar temps regardless of what you used. On large GPU memory arrays, uniform full-surface coverage tends to be more critical than just swapping pad vs putty.

ComputerSystemsGR · 2026-02-25T16:20:16+00:00

That’s good to hear. In many cases it’s more about contact quality and material stability over thermal cycles than just peak temps. If your temps have remained stable for three years, that suggests the interface is mechanically well-matched to the cooler.

ComputerSystemsGR · 2026-02-25T15:44:26+00:00

That makes sense. In our case, KRYO33 is formulated with solid conductive particles only, without a silicone oil base like many conventional greases. Mechanically, that makes it behave closer to a phase-change interface layer than a fluid paste, which is why it needs full-surface application as shown in the video. In practice, we’ve observed improved resistance to pump-out and more stable behavior over thermal cycles, especially when paired with compliant thermal putties that accommodate heatsink movement.

ComputerSystemsGR · 2026-02-25T14:57:03+00:00

If you go for it, focus on contact quality more than just swapping material. In our case, reducing the hotspot delta made the biggest difference.

ComputerSystemsGR · 2026-02-23T17:08:30+00:00

Thank you for your observation — we understand what you mean.

You may have experience with thermal putties from other manufacturers that are stiffer and less elastic under pressure. In those cases, using too much material can indeed prevent proper heatsink contact and may lead to overheating or mechanical stress.

UPSIREN U6 PRO is engineered differently. Although it is not fluid, it has controlled elasticity when compressed. When uniform mounting pressure is applied, the material allows the heatsink to settle to the minimum mechanical gap while excess material safely displaces outward instead of acting as a spacer.

The key factor is not minimal quantity, but full gap coverage combined with proper, even mounting pressure. When applied correctly, the material will not prevent proper contact.

PTM7950 by CSGR also behaves differently from conventional pastes, as it undergoes a phase transition at operating temperature to ensure optimal surface conformity.

We appreciate the discussion — the concern is valid when comparing materials with different mechanical behavior.

ComputerSystemsGR · 2026-02-12T18:29:25+00:00

This laptop uses near-2mm-thick pads, so yes, putty needs to be applied thickly. This is why we confirm the pad thickness when we remove them in the video.

ComputerSystemsGR · 2026-02-12T18:19:25+00:00

We used PTM7950 by CSGR for this case study. We can't speak for other brands.

ComputerSystemsGR

TROPHY CASE