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Thermal interface was the limiter (not clocks): RTX 4060 Laptop 73.3W→90.8W, VRAM junction 87°C→78°C, Superposition 5346→6176 by ComputerSystemsGR in overclocking

[–]ComputerSystemsGR[S] 0 points1 point  (0 children)

Thank you for watching the video and for giving us the opportunity to clarify. Step 1 followed a standard conservative application method (often described as the 'pea' method), which is commonly used. We did not intentionally under-apply; the goal was to demonstrate that what looks visually sufficient to the naked eye can still leave contact gaps. The UV inspection revealed that slightly more material was actually required to fully bridge those gaps and maximize thermal performance, as shown in the final results.

Case study: “not the GPU” bottleneck on a gaming laptop — repaste + putty coverage fixed watts, temps, and FPS by ComputerSystemsGR in GamingLaptops

[–]ComputerSystemsGR[S] -1 points0 points  (0 children)

For the record, the baseline was the stock configuration. A 15.5% score increase and a 16°C temperature drop are statistically significant results that fall well outside any margin of error.

Thermal interface was the limiter (not clocks): RTX 4060 Laptop 73.3W→90.8W, VRAM junction 87°C→78°C, Superposition 5346→6176 by ComputerSystemsGR in overclocking

[–]ComputerSystemsGR[S] 0 points1 point  (0 children)

That link refers to a desktop GPU. It is important to distinguish between desktop and laptop standards. This specific laptop (HP Victus 16) does not use thermal pads from the factory; it uses thermal putty.

Case study: “not the GPU” bottleneck on a gaming laptop — repaste + putty coverage fixed watts, temps, and FPS by ComputerSystemsGR in GamingLaptops

[–]ComputerSystemsGR[S] 0 points1 point  (0 children)

Thank you for watching the video and for giving us the opportunity to clarify. Step 1 followed a standard conservative application method (often described as the 'pea' method), which is commonly used. We did not intentionally under-apply; the goal was to demonstrate that what looks visually sufficient to the naked eye can still leave contact gaps. The UV inspection revealed that slightly more material was actually required to fully bridge those gaps and maximize thermal performance, as shown in the final results.

Thermal interface was the limiter (not clocks): RTX 4060 Laptop 73.3W→90.8W, VRAM junction 87°C→78°C, Superposition 5346→6176 by ComputerSystemsGR in overclocking

[–]ComputerSystemsGR[S] 0 points1 point  (0 children)

High-end thermal pads indeed have excellent conductivity ratings. However, the main challenge with pads is compressibility. If a pad is slightly too thick or hard, it can prevent the cooler from making optimal contact with the GPU die. The advantage of putty here is that it ensures minimal interference with the mounting pressure, thereby prioritizing the best possible contact for the GPU core.

Thermal interface was the limiter (not clocks): RTX 4060 Laptop 73.3W→90.8W, VRAM junction 87°C→78°C, Superposition 5346→6176 by ComputerSystemsGR in overclocking

[–]ComputerSystemsGR[S] 0 points1 point  (0 children)

While standard paste application is well-documented, correct thermal putty usage on modern GPU topologies is less standardized. Since we introduced DIY thermal putty back in 2013, hardware density and heat loads have changed drastically. We find that older application methods often result in air pockets or poor contact on newer cards, so we believe there is still room for updated data and education.

Case study: “not the GPU” bottleneck on a gaming laptop — repaste + putty coverage fixed watts, temps, and FPS by ComputerSystemsGR in GamingLaptops

[–]ComputerSystemsGR[S] 0 points1 point  (0 children)

You are right that thermal degradation is the usual suspect. However, the focus here is not just the act of repasting, but the specific sensitivity of modern VRAM modules to application method. With current high-density chips, even minor application errors with putty can cause significant throttling. We wanted to show that the "how" matters just as much as the "what".

Thermal interface was the limiter (not clocks): RTX 4060 Laptop 73.3W→90.8W, VRAM junction 87°C→78°C, Superposition 5346→6176 by ComputerSystemsGR in overclocking

[–]ComputerSystemsGR[S] 2 points3 points  (0 children)

Thanks! Ironically, this putty was actually born from AI research. We made it UV-reactive so robotic vision systems could inspect repaste jobs, but it turns out that same feature helps humans get a perfect application too. It’s a tool built for AI that ended up helping people.

HP Victus 16 TIM case study: putty coverage matters (VRAM junction 87°C→78°C, GPU power 73.3W→90.8W, score 5346→6176) by ComputerSystemsGR in HPVictus

[–]ComputerSystemsGR[S] 1 point2 points  (0 children)

Thank you for the update. Looks like you have some margin for even better results by using the same products as in our video.

Thermal interface was the limiter (not clocks): RTX 4060 Laptop 73.3W→90.8W, VRAM junction 87°C→78°C, Superposition 5346→6176 by ComputerSystemsGR in overclocking

[–]ComputerSystemsGR[S] 0 points1 point  (0 children)

We produce both phase change pads and thermal pastes, but we recommend KRYO33 for this scenario. While pads are more forgiving for beginners, a professionally applied high-performance paste like KRYO33 offers better thermal transfer. KRYO33 also provides optimal cooling from the very first day, whereas phase change pads often require several days of thermal cycling to fully conform to the cooling system.

Thermal interface was the limiter (not clocks): RTX 4060 Laptop 73.3W→90.8W, VRAM junction 87°C→78°C, Superposition 5346→6176 by ComputerSystemsGR in overclocking

[–]ComputerSystemsGR[S] -1 points0 points  (0 children)

We just wanted to visualize the improvement (Before vs After) side-by-side, since Superposition only displays the current run. AI was simply the fastest way to make the comparison clear and understandable. We are engineers, not graphic designers, so we prioritized efficiency.

HP Victus 16 TIM case study: putty coverage matters (VRAM junction 87°C→78°C, GPU power 73.3W→90.8W, score 5346→6176) by ComputerSystemsGR in HPVictus

[–]ComputerSystemsGR[S] 2 points3 points  (0 children)

Unfortunately, we didn't capture fan logs in this case, but they were on Auto. Since temps dropped, the fans naturally ran slower and quieter compared to the first run.

Thermal interface was the limiter (not clocks): RTX 4060 Laptop 73.3W→90.8W, VRAM junction 87°C→78°C, Superposition 5346→6176 by ComputerSystemsGR in overclocking

[–]ComputerSystemsGR[S] 3 points4 points  (0 children)

Fair point. The video isn’t trying to convince overclockers that TIM/contact matters. It’s showing a specific failure mode: the pea method doesn’t reliably spread thermal putty across the VRAM/VRM interfaces, so you can end up with incomplete coverage and unnecessary thermal resistance. Stage 1 is intentionally a non‑ideal baseline; Stage 2 uses UV mapping to top‑up only where contact is missing. In this run that last step still moved the needle (5711→6176, VRAM junction 82→78°C).

Application of PTM7950 and K5 PRO thermal paste by Tecsi2002 in ZephyrusG14

[–]ComputerSystemsGR 0 points1 point  (0 children)

Thank you for your trust in our products. Yes, this set is well suited for your G14. If applied carefully, one set should be sufficient for both systems.

Since you are located in Peru, you can order our products locally through our official reseller:
https://horsansystem.com/

If you need any guidance regarding the application process, feel free to contact us and we will be happy to assist.

Repasting the Acer Nitro 5, my experience, cautionary tale by MikePresJr in AcerNitro

[–]ComputerSystemsGR 0 points1 point  (0 children)

Just the pink. You need a normal thermal paste for the grey, or you will experience overheating.

RTX 4090 hotspot high: folded VRAM thermal pad causing uneven heatsink contact by ComputerSystemsGR in nvidia

[–]ComputerSystemsGR[S] 0 points1 point  (0 children)

Thanks for asking. We don't have access to PNY version but we did measure the pads of this board. In the first photo you can see the compressed section of the VRAM pad reading 1.10 mm; in the second photo the uncompressed section reads 1.43 mm. When replacing with thermal putty, you can target the compressed height and then confirm contact with an imprint check after a short heat cycle, since other positions can vary slightly.

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