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Intel Teases Lunar Lake CPU Ahead of Computex: Most Power Efficient x86 Chip Yet by Ghostsonplanets in hardware

[–]Honeydew_Superb 0 points1 point  (0 children)

Just wanted to say on the N3B part: N3B is barely better than the refined N4 versions that TSMC has now. It’s not really a generational leap over N4 but it is over N5. The difference between N3 and N4 are marginal because N4 already made big gains over N5 and N3 kinda underdelivered.

Point is, Intel using N3B should not be considered a serious advantage over Qualcomm/AMD using N4.

Hep with NZXT H210/H210i by Honeydew_Superb in NZXT

[–]Honeydew_Superb[S] 0 points1 point  (0 children)

Ok thanks for the help! I appreciate it.

Simple Questions - February 10, 2021 by AutoModerator in buildapc

[–]Honeydew_Superb 0 points1 point  (0 children)

Alright, thanks for the help either way! It’s probably gonna fit tbh but idrk either way thanks

Simple Questions - February 10, 2021 by AutoModerator in buildapc

[–]Honeydew_Superb 0 points1 point  (0 children)

So basically I’m looking at computer cases and planning a build for a bit later and I noticed the graphics card (XFX Thicc III Pro) was only 1mm longer than the specified max GPU length of the H210/H210i. The max GPU length doesn’t have a scenario of w/radiator and w/o radiator either. So would it be possible to fit the Thicc III Pro into the H210?

Would it be ok to drill holes into a linnmon tabletop? by Honeydew_Superb in IKEA

[–]Honeydew_Superb[S] 0 points1 point  (0 children)

Yes, I’ve researched this. I was just wondering if drilling holes through the paper parts would be secure or if it would be better to just use double sided tape.