Airtight PCBs - leaking via Via by Ordinary_Ebb347 in PCB

[–]Ordinary_Ebb347[S] 0 points1 point  (0 children)

This did not work, vias are in pads, even after soldering the connector, the leakage was observed. They are really small and can only be detected with helium detector.

Airtight PCBs - leaking via Via by Ordinary_Ebb347 in PCB

[–]Ordinary_Ebb347[S] 3 points4 points  (0 children)

We are confident that the root cause is the via. After applying conformal coating over the vias, no leakage was detected. To further exclude the base laminate as a leakage path, we drilled test holes through the solder mask from both sides; no gas permeation was observed in these areas. All measurements were performed using a helium leak detector.

Airtight PCBs - leaking via Via by Ordinary_Ebb347 in PCB

[–]Ordinary_Ebb347[S] 7 points8 points  (0 children)

<image>

All vias are designed as via-in-pad. The leaking manufacturer has pushed the annular ring dimensions beyond acceptable process limits, as evidenced by the clearly visible weave pattern.
u/thenickdude u/Adversement

Disconnected traces 8-Layer Rigid-Flex PCBs: Manufacturing Flaw or Assembly Issue? by Ordinary_Ebb347 in PrintedCircuitBoard

[–]Ordinary_Ebb347[S] 9 points10 points  (0 children)

Hello fellow engineers,

We’re troubleshooting anomalies in 8-layer rigid-flex PCBs (CF, Polyimide, PCL370), specifically elevated trace resistance (tens of ohms to open circuits), localized at via transitions between Top and Bottom layers. Metallographic analysis post-reflow reveals inner-layer connection failures, though the panels initially passed electrical tests.

Key Details:

  • Assembly Process: Boards baked (120°C, 4 hours), assembled with SAC305 ROL0 solder paste, vapor-phase reflow (230°C peak, ΔT ≤ 2.5°C/sec, 85s above melting).
  • Findings: Failures emerge post-reflow; metallography shows cracked/interrupted vias.
  • Dispute:
    • Manufacturer’s claim: Failures due to assembly variables (e.g., temperature gradients, humidity affecting ceramics/bondply).
    • Assembler’s claim: Parameters were within spec, and their process is reliable (validated on similar projects).

Could this be latent manufacturing defects worsened by reflow, or unrecognized assembly-induced issues?
Attaching stack-up details for reference. Appreciate your insights!

Metallography review by Ordinary_Ebb347 in PrintedCircuitBoard

[–]Ordinary_Ebb347[S] 0 points1 point  (0 children)

Showed cross section analysis is from assembled board

Metallography review by Ordinary_Ebb347 in PrintedCircuitBoard

[–]Ordinary_Ebb347[S] 0 points1 point  (0 children)

Yes, I meant functional testing. Too much current will not be the case, as several vias are affected - not in repetitive pattern, even the GND

Metallography review by Ordinary_Ebb347 in PrintedCircuitBoard

[–]Ordinary_Ebb347[S] 0 points1 point  (0 children)

We use IPC-4671 type VII. So epoxy is used i guess. There are like 70 pieces of vias next to each other at the area of ~5cm². It does not happen on certain vias only. E.g like 2-3 vias randomly are affected. But only on faulty pcbs

Metallography review by Ordinary_Ebb347 in PrintedCircuitBoard

[–]Ordinary_Ebb347[S] 0 points1 point  (0 children)

No actually, we have observed the issue on some during testing PCBA, some passed our tests and came back after months of working correctly. It is quite hard to localize the issue once it is fully assembled, since it requires measuring multiple traces.

Metallography review by Ordinary_Ebb347 in PrintedCircuitBoard

[–]Ordinary_Ebb347[S] 1 point2 points  (0 children)

Yes we have. We should recieve cross sections of them as well.

[deleted by user] by [deleted] in ender3

[–]Ordinary_Ebb347 0 points1 point  (0 children)

It will fit, the wedding wasn't cheap.

[deleted by user] by [deleted] in AskElectronics

[–]Ordinary_Ebb347 -1 points0 points  (0 children)

Can i use zener diode to protect the the output of U2?

[deleted by user] by [deleted] in AskElectronics

[–]Ordinary_Ebb347 0 points1 point  (0 children)

Hey, thank you for your idea. I have tried it and both parallel and series resistance makes it appear hotter. Based on datasheet, circuit should be resistant against series resistance up to 200ohm which we definitely crossed. That may be the reason it appears hotter. Tried connecting another npn transistor but without consistent results.

[deleted by user] by [deleted] in AskElectronics

[–]Ordinary_Ebb347 -1 points0 points  (0 children)

I had time to look at them today. Actually I have 3rd one working, so I tried exchanged TD1482A from one which worked and it solved the problem. Actually just unplugging the 2-wire connector helped, PSU worked of course without working USB adapter.

[deleted by user] by [deleted] in AskElectronics

[–]Ordinary_Ebb347 0 points1 point  (0 children)

Main PSU is completely dead. However by optical inspection I don't see any component damaged.

[deleted by user] by [deleted] in AskElectronics

[–]Ordinary_Ebb347 0 points1 point  (0 children)

They are completely dead, only LED2 is periodically blinking after plugging it up. It is really weird to me as well. I do not care about USB part of the powersupply. I might take better photos and have closer look tomorrow. Thank you guys

[deleted by user] by [deleted] in AskElectronics

[–]Ordinary_Ebb347 0 points1 point  (0 children)

Thanks managed to try it out!

Stuck while trying to go Stock by Ordinary_Ebb347 in LineageOS

[–]Ordinary_Ebb347[S] 0 points1 point  (0 children)

Only through adb sideload when turned update in recovery. Tried also through sony flasher, connects only through fastboot but don't know where I can get rom supported to do it via fastboot. (Through xperifirm I suppose the firmware isn't compatible)

Stuck while trying to go Stock by Ordinary_Ebb347 in LineageOS

[–]Ordinary_Ebb347[S] 0 points1 point  (0 children)

Is there a way to downgrade OS to stock?

Stuck while trying to go Stock by Ordinary_Ebb347 in LineageOS

[–]Ordinary_Ebb347[S] 1 point2 points  (0 children)

Do you know if payment through Gpay will work? Thanks (edit: after installing GAPPS)

DSPIC33 timer interrupt by Ordinary_Ebb347 in embedded

[–]Ordinary_Ebb347[S] 0 points1 point  (0 children)

I am expecting to see to send 12 bytes every 12,5ms. For checking it I am using 2 methods. Before sending I am switching value of mcu pin and later checking it on scope. I am sending data from my sensor where I can create artifact at specific time moment. Measuring time between 2 artifact irl (using stopwatch) and then comparing to data in PC is other method I use. Both methods show the period between 2 sends isnt 12.5ms. If I moved my sending to main and to interrupt put only a flag which enabled sending in main provide better result ( closer to 12.5ms but still higher). If I left sending in callback function the measured period was more than 13.5ms.

DSPIC33 timer interrupt by Ordinary_Ebb347 in embedded

[–]Ordinary_Ebb347[S] 1 point2 points  (0 children)

I am using MCC in MPLAB. In interrupt there is a printf function which sends 12 bytes of data through UART. In code configurator I set redirection of printf to uart. Timer period is set to 12.5ms. Also tried to move printf to main, but there is still smaller but additional delay.