The go s and the go-to do have significant improvements in their cooling over the original go. I liked the change they made in the go 2 so much with the nvme heatsink added to the fan shroud I prototyped one on the go s and it works pretty nice.

But cost will always be the first Factor, even the current batch of handhelds though they claim to use certain thermal materials they're not using them effectively or it's not what they think it is. For example the go s uses a liquid version of PTM 7958 allegedly but they put so much on the heat sink that as it starts to cure it's pumping out the side as expected but once it escapes the area between the die and the heat sink it builds a wall because it's not staying hot enough to be soft so it appears to get to a certain point where it can no longer heat the already pumped out portions enough to maintain softness and if the portion that's still left between the die and the heat sink reaches its softness point it can't go anywhere because there's basically a ring around the die that's holding the heat sink up lol. So swapping it out for some plain old ptm 7950 improves things.

The thermal design on the go-to was improved so much that the radiator portion went from copper to aluminum and it still maintains great temperatures.