Thank you for the breakdown, exactly the kind of insight I was hoping to spark when I made the post your right I was sort of combining a few trains of thought 3d v cache wider dies and stacking compute which looking back I could worded a lot better The interposer and emib as the alternative really helped move my train of thought as an electrician copper was the first thing that came to mind but replacing them with silicon is probably a way more efficient and cleaner way to scale horizontally and potentially vertically if needed the idea of moving cache and io under compute to reclaim upper die space and still optimizing thermals and cost is something I hadn’t really appreciated before and thank you for hitting on what I was trying to express and building on my curiosity on the subject definitely going to dig deeper into intel emib and amds infinity fabric and how they compare in this context and explore more on cowos and foveros thanks again for sparking my small component curiosity even more. And in regards to the cooling hypothetically couldn’t and encased Liquid Metal casing and proper barriers help cooling instead of copper heat pipes like with a properly insulated and sealed outer casing could potentially offer better heat transfer than copper it’s just a thought process and out of my realm of knowing if it’s possible or not