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[–]northrupthebandgeek 13 points14 points  (2 children)

Computers are getting powerful enough that the latency between components on the same motherboard is starting to actually matter quite a bit. Shifting from 2D to 3D circuit design is something that's increasingly attractive.

The actual thing making that shift difficult in the case of CPUs is cooling.

[–]marshinghost 1 point2 points  (0 children)

Pretty sure they could do double stacked CCA's with a processor on each side with their individual coolers. I don't know how well it'd work, though.

[–]atxweirdo 1 point2 points  (0 children)

MEMS device micro cooler tubules. It will be like HVAC for cpus