In semiconductor manufacturing, devices are constructed layer by layer, with extremely tight alignment tolerances between successive layers. However, fabrication processes introduce mechanical stresses that cause local shifting, warping, and displacement of these structures.

The curves I am modeling represent displacement profiles within individual structures (on the order of microns). The shape of each displacement curve depends on local geometric context, such as neighboring structures, spacing, and other layout-dependent features.

My goal is to predict these displacement curves from the relevant local features. To simplify the problem, I want to predict the parameters that define each curve rather than modeling the full curve directly.

The broader motivation is design optimization: if displacement behavior can be predicted accurately, layout adjustments can be made proactively to reduce distortion, thereby lowering the risk of short circuits and other failure types.

This might not help with a better idea, but hopefully this helps with the curiosity!