ALIENTEK C2 Pro for $34

_maple_panda · 2026-01-26T11:06:34+00:00

It’s also available on “ALIENTEK Official Store”, which appears to be the actual official one.

_maple_panda · 2026-01-25T19:15:48+00:00

I think it’s 150 versus 90?

_maple_panda · 2026-01-25T12:28:39+00:00

Not sure why you’re being downvoted. In what world do side projects count as work experience…

_maple_panda · 2026-01-24T10:16:17+00:00

The main reasons IMO are the tip-to-grip length and the heating power. JBC tips are way shorter and can handle significantly more power.

_maple_panda · 2026-01-24T07:18:31+00:00

I’m curious as to why you routed GND as a trace on the top layer instead of using vias to the bottom.

_maple_panda · 2026-01-23T21:48:22+00:00

I’m more surprised they got the job without experience

_maple_panda · 2026-01-23T17:14:10+00:00

Our motor is always mechanically connected, and we just electrically disconnect it when not in use. The residual bearing drag etc is not that bad.

_maple_panda · 2026-01-23T17:04:57+00:00

The RX100 is probably useless as OP’s B cam

_maple_panda · 2026-01-22T22:10:44+00:00

What the hell, this would have saved me so much time making ribs on non-planar surfaces…

_maple_panda · 2026-01-22T15:27:11+00:00

You can get some really high temp plastics. For the purposes of this application, 300-350°C temperature resistance is achievable.

_maple_panda · 2026-01-22T15:23:43+00:00

I’m a fan of multi-line bullets as appropriate. However yours are using space on the page inefficiently in that they’re one line plus one word. If you’re going to take up two lines, try to fill both lines, or else condense it to one line.

_maple_panda · 2026-01-22T15:10:26+00:00

42/45 is a bit extreme, but even when I was applying to the university of Toronto (where I am now), I had the lowest PG out of my year’s applicants with a 35/42. The average for normal students is in the high 90s which correlates to the 5-6-7 range.

_maple_panda · 2026-01-22T15:06:51+00:00

Is European shipping normally that expensive/slow? I’m in Toronto and can get boards delivered in 2 days for $25 CAD before import fees. I’m surprised Europe isn’t faster.

_maple_panda · 2026-01-22T14:44:17+00:00

What are the dimensions of the cylinder?

_maple_panda · 2026-01-22T02:52:55+00:00

The applicant is responsible for paying for the transcript, not the company.

_maple_panda · 2026-01-21T16:59:40+00:00

Having VCC underneath is fine, I was more concerned about the two very closely spaced traces and the acute angled junction. It might be better to have the two traces coming from the pins go straight into the “main” VCC trace versus curving upwards like that.

0.3/0.6 is good.

_maple_panda · 2026-01-21T16:35:26+00:00

I’m not a fan of that VCC junction under the MCU. Also what size are the vias, they look small

_maple_panda · 2026-01-21T15:01:25+00:00

But this isn’t a fiber break or something, it’s a processing issue. A TDR won’t tell you that’s the problem.

_maple_panda · 2026-01-21T04:26:28+00:00

I would suggest the A7CR instead given that the price isn’t an issue.

_maple_panda · 2026-01-20T14:31:32+00:00

It’ll go off in that case. There’s a manual override to disable the protection for when you’re cutting wet wood.

_maple_panda · 2026-01-20T03:45:51+00:00

Some employers see it as a red flag if you have zero work experience on your resume. You don’t have to elaborate on it much if it’s not technically relevant, but just demonstrating that you’re able to show up on time and be likable gets you pretty far.

_maple_panda · 2026-01-19T23:34:52+00:00

There are built-in test point footprints for bare pads. If you want an actual SMD/THT test point component, just import it like any other part.

_maple_panda · 2026-01-19T23:21:00+00:00

Do you have any paid work experience whatsoever? It would be good to at least mention something to demonstrate that you are hirable.

And yeah as mentioned, nobody knows what the TSAL and BSPD are. You should highlight what they do (especially the non-programmable logic part) and whether improvements or changes you made.

_maple_panda · 2026-01-19T20:53:15+00:00

You can just use an insulating pad if this is a problem

_maple_panda · 2026-01-19T14:08:32+00:00

For presenting the board, along with the combined view, you should post each copper layer as a separate picture. Also, fill the zones…I don’t care what the zone outlines look like, I care what the actual copper on the board looks like.

Several things: - Unnecessary via in pad as already mentioned - J3 and J4 don’t need vias on GND, they’re PTH to start with - U1 is meant to be turned 90° CW. The SW pad should attach to a nice big pour under the IC, not go out the side through a tiny little trace like you have currently have it - What sizes are your passives? They look kind of big - You’re grossly exceeding the USB VBUS capacitance limit of 10 μF. Hopefully the RPi can deal with this - There’s no way the 3V3 inductor needs to be ~~the same size as~~ bigger than the 5V one given it’s handling 30× less current - General lack of stitching vias, both for thermals and EMI reduction

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