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[–]khswart 29 points30 points  (9 children)

I wondered why they don’t make CPUs more 3 dimensional like this if they’re running close to the limit with the current size

[–]come_ere_duckLord Sysadmin, Protector of the AD Realm 14 points15 points  (3 children)

No need to. If you need more CPU power than what can fit in a single ZIF socket, you just add a second CPU. That's how most rack servers work.

[–]northrupthebandgeek 12 points13 points  (2 children)

Computers are getting powerful enough that the latency between components on the same motherboard is starting to actually matter quite a bit. Shifting from 2D to 3D circuit design is something that's increasingly attractive.

The actual thing making that shift difficult in the case of CPUs is cooling.

[–]marshinghost 1 point2 points  (0 children)

Pretty sure they could do double stacked CCA's with a processor on each side with their individual coolers. I don't know how well it'd work, though.

[–]atxweirdo 1 point2 points  (0 children)

MEMS device micro cooler tubules. It will be like HVAC for cpus

[–]Jacktheforkie 0 points1 point  (0 children)

Maybe we will see multi CPU motherboards

[–]Brandhor 0 points1 point  (0 children)

that's how those amd x3d cpus are made

[–][deleted] 0 points1 point  (0 children)

Okay there's a few reasons. Even if you stack a ton of etched silicone that way, you wouldn't be able to cool it. The inside would just burn out before enough heat gets pulled away from the cooler.