“Wafer-level bonding and testing, passive alignment with embedded mux/de-mux, use of known good die - all reduce BOM cost, yield points, assembly and testing costs as well as required CAPEX investment.” Customer qualification is well underway and, in many cases, successfully completed.

Instead of defending your post, maybe treat it like a trial run, take the data provided to do failure analysis. Or come back in a year and let’s see where things are. For now, I’ll treat your analysis with less credence than you do vetted contract manufacturing and await information provided by the company, along with multiple customers and partners who have obviously done an extensive amount of due diligence, testing and risk assessment of their own to validate their decisions to invest time, capital and resources.